RoHS1030−µF8.0MRF
XC3S250E-4FTG256IPhoto for reference; actual part appearance may vary.

XC3S250E-4FTG256I

Manufacturer: AMD Xilinx

Embedded Block RAM: 221184bit; Logic Array Blocks: 612; Operating Temperature: -40℃~+100℃ · FTBGA-256(17x17) · FPGAs (Field Programmable Gate Array)

DatasheetRoHS compliant
Stock quantity13
Lead time1-3 Days
Min. package qty (MPQ)1

Price breaks (USD)

QuantityUnit price
1+$49.7139
30+$47.9062
Total:

+86 13760275678 · [email protected]

Prices and stock are reference data — please contact us to confirm.

Specifications

Part numberXC3S250E-4FTG256I
ManufacturerAMD Xilinx
CategoryIntegrated Circuits (ICs)
Sub-categoryFPGAs (Field Programmable Gate Array)
PackageFTBGA-256(17x17)
Embedded Block RAM221184bit
Logic Array Blocks612
Operating Temperature-40℃~+100℃
RoHSYes
Min. package qty (MPQ)1
Lead time1-3 Days
Stock quantity13
DatasheetDatasheet (PDF)

Description

XC3S250E-4FTG256I — FPGAs (Field Programmable Gate Array) from AMD Xilinx. Package: FTBGA-256(17x17). Key parameters: Embedded Block RAM: 221184bit; Logic Array Blocks: 612; Operating Temperature: -40℃~+100℃. Availability, price breaks and lead time are confirmed when you contact us.